NIKKEI MESSE > LED Next Stage > APIC YAMADA > Transfer Molding System for Liquid Compound "LTM Series"

Exhibitor Product

Transfer Molding System for Liquid Compound "LTM Series"

Apic Yamada lined up LTM series from 60 to 170 Ton to capable maximum 100 x 300mm x 2 substrates per Mold.
Also provides the both Pre-Mix and Post-Mix type compound dispenser, to comply to various customer's needs.

Exhibit Category

Contact
ExhibitorAPIC YAMADA
Department in chargeSales Department
Phone026-276-8226
E-mailnakazawah@apicyamada.co.jp

Exhibitor Profile

APIC YAMADA

Cost reduction of LED and module encapsulation. Total solution for High brightness LED assembly technologies, from Lead frame design, Mold encapsulation and Singulation.

This Exhibitor's Products and Services

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