APIC YAMADA
| Department in charge | Sales Department |
|---|---|
| Address | 90, Kamitokuma, Chikuma-shi, Nagano 389-0898 |
| Phone | 026-276-8226 |
| nakazawah@apicyamada.co.jp | |
| URL | http://www.apicyamada.co.jp/ |
Cost reduction of LED and module encapsulation. Total solution for High brightness LED assembly technologies, from Lead frame design, Mold encapsulation and Singulation.
Booth No : LD10442012 Exhibitor
Summary of Business
Apic Yamada developed the mold dieset in 1969. After that, we develop, design, manufacture and sell mainly the material (stamping leadframe), mold equipment and singulation equipment in the process of the semiconductor back-end assembly industry.
Additionally, we apply the technology of processing point studied from our experience to the various fields. For instance, its technology is applied to LED which are different type of business part.
Apic Yamada accomplishes further evolution!!
